MCNEX and Valens Semiconductor have jointly launched what they describe as the industry’s first automotive-grade QHD (2560×1440) front and rear cameras capable of transmitting video over unshielded twisted pair (UTP) or low-cost coaxial cables. The new camera family is powered by Valens’ VA7000 A-PHY chipsets, enabling multi-gigabit connectivity while reducing wiring complexity and system costs for automotive OEMs.
The solution leverages the bandwidth and electromagnetic compatibility (EMC) robustness of the VA7000 chipset, built on the MIPI A-PHY standard. By supporting multi-gig link speeds over unshielded cables and connectors, the platform allows OEMs to streamline vehicle wiring harnesses—particularly for interior Advanced Driver Assistance Systems (ADAS) applications such as cabin-mounted front and rear cameras.
The ability to deliver QHD video over simpler cabling provides automakers with a compelling option to lower vehicle weight and material costs while maintaining high image quality for next-generation ADAS and autonomous driving systems.
In addition to the QHD models, MCNEX is introducing a new 4K 60fps rear-view camera operating over shielded cabling, also based on the VA7000 chipset platform. The chipsets are already in mass production, with first OEM vehicle start-of-production (SoP) expected in early 2027.
Young Hyun Jeong, VP of the Automotive Business Unit at MCNEX, stated that the collaboration builds on the company’s history of delivering advanced imaging systems to global automakers. By integrating its camera design expertise with Valens’ connectivity technology, MCNEX aims to provide OEMs with scalable, high-performance front- and rear-facing camera options.
Adar Segal, Head of Automotive Business at Valens Semiconductor, emphasized that automakers face mounting pressure to increase sensor resolution and bandwidth while controlling cost, weight, and ensuring uncompromised safety. The VA7000 chipset family enables long-reach, multi-gigabit links over simple cable topologies, supporting higher-resolution ADAS architectures with greater flexibility.
The collaboration highlights the growing role of standardized high-speed connectivity in automotive design. By utilizing MIPI A-PHY–based technology, the VA7000 platform enables reliable high-bandwidth transmission over both UTP and low-cost coax, supporting cost-sensitive, high-volume vehicle platforms.
As vehicles integrate more cameras and higher data rates, reducing harness complexity while preserving signal integrity becomes critical. The MCNEX-Valens solution positions unshielded cabling as a viable alternative for specific automotive applications, potentially accelerating the adoption of scalable, high-resolution imaging systems across global OEM platforms.
